ThermoEdge · Orbit
An orbital data center
and a communications network.
One constellation.
Solar in. Heat out. Compute and connect between.
Built by Thermodynamic Edge Intelligence Corp. — a subsidiary of Open Interface Engineering.
Who is making this
Thermodynamic Edge
Intelligence Corp.
A subsidiary of Open Interface Engineering. We build a constellation of hex tiles that, together, run as an orbital data center and a communications network in the same envelope.
Designed to the vacuum limit. Deployed everywhere easier.
Compute
TESilicon in every tile
Connect
Tile-to-tile mesh + downlink
Container
The hex tile
01 · The compute
What’s inside the tile.
Each tile carries a TESilicon module — the first ThermoEdge chip, a heterogeneous die that routes each operation to the substrate whose physics performs it natively.
Five substrate columns: photonic for linear algebra, stochastic for sampling, reversible for energy-recovering logic, neuromorphic for event-driven inference, quantum for hard distributions. The compiler dispatches by measured joule cost.
Energy flow · one tile
Orbital mesh · one envelope
compute relays · mesh routes · one downlink
02 · The communication
Every tile is a data center and a relay.
The constellation does two jobs from the same hardware: compute the workload onboard and carry it across the network. Inference runs at the tile. Tile-to-tile optical links carry the result to the gateway tile. The gateway downlinks to ground.
Two services, one envelope. The radiator that cools the compute is the same radiator that cools the radios. The solar array that powers the compute is the same array that powers the link. The energy budget pays once.
03 · The container
Hex tiles. Dock to grow.
The tile is the unit. Solar on one face, radiator on the other, six EPM-docked edges, six inter-tile data paths. Add a tile, gain a node, gain a radiator, gain six routes.
Hex wins the geometry. Square gives you four neighbors; hex gives you six. The mesh degree, the thermal spread, and the failure-isolation graph all live in that one extra edge.
Hex tile farm · planar scaling
6−degree mesh · planar farm · additive scaling
Where this lives
Same core. Every envelope.
Three deployments of one artifact, built under one set of parent commitments.
In silicon
TESilicon
The chip that runs inside every tile. Heterogeneous RISC-V, in-memory analog, unified persistent memory, on-die harvesting. First chip Zero in fab today.
tesilicon.thermoedge.ai →On the ground
Corridor
The same core deployed along every American mile. Energy, compute, and communications from one integrated install on existing infrastructure.
corridor.thermoedge.ai →In vacuum · you are here
Orbit
The hex tile farm at the design crucible. Built to close its own thermodynamic budget — so it closes trivially everywhere else.
you are hereThe parent commitments
Priced in joules
Every primitive metered. The customer pays the second law — not a markup over it.
Make once, use forever
The unit of sale is the artifact’s lifetime. No refresh cycle. Components do not get replaced; the artifact gets retired.
Return the substrate
At end of life the unit comes back. The substrate is re-made. A closed loop the second law underwrites.
